
Each ARMS 200 unit delivers up to 1.8 MW of critical IT load in a compact, rapidly deployable package — designed for Tier III redundancy and concurrent maintainability.
Explore SpecsDigiPowerX is built around a simple but powerful thesis:
the company that controls power controls the compute.
By owning the full infrastructure stack from energy generation through GPU compute, DigiPowerX can serve AI and HPC customers faster, cheaper and at greater scale than any
pure-play competitor.
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Interact with our modular data centre unit. Click the front panel to open it and reveal the internal rack infrastructure. Drag to rotate the model in 3D space.
Designed for next-gen GPU architectures with full liquid cooling support.
Stack and combine units to match any capacity requirement from kW to MW.
SOC 2 Type II, ISO 27001 and HIPAA compliant infrastructure.
Built-in UPS, PDUs and switchgear for self-contained power delivery.

Owned power generation assets and substation access create a structural cost and speed advantage that competitors building on leased utility power cannot replicate. The North Tonawanda plant produces at approximately $0.04/kWh.
The facility is backed by a 200MW
grid-connected substation with redundant feeders, securing hydro-power for
long-term pricing stability.

The company converts owned power assets into high-density, AI-ready data center capacity — targeting Tier III classification, direct liquid cooling and 200kW+ per-rack GPU density at the Alabama facility. Features custom closed-loop liquid-to-chip heat rejection configurations designed to sustain heavy Blackwell workloads.

NeoCloudz is the compute layer on top of the DigiPowerX infrastructure stack providing bare-metal GPU access, 400G InfiniBand fabric, and enterprise-grade telemetry for AI training, inference, and HPC workloads. Interconnects are optimized with RDMA support to allow seamless scaling of multi-node model execution.
The ARMS 200 is DigiPowerX's proprietary modular data-center platform.
Each module delivers up to 1.8 MW of critical IT load and is designed for Tier III redundancy (concurrent maintainability).
The system's prefabricated architecture allows rapid on-site assembly and integration with chilled-water or direct-to-chip cooling systems, making it the ideal solution for AI-ready infrastructure.
High-density power infrastructure built for AI workloads.
Direct-to-chip liquid cooling for maximum efficiency.
GPU-ready architecture optimized for next-generation AI.
Modular design enabling rapid capacity expansion.

The next evolution of our ARMS platform, delivering even greater capacity and efficiency for next-generation AI workloads.

DigiPowerX leverages industry-leading technology through partnerships with:
Whether you need co-location, a turnkey data center build, or bare-metal
GPU compute - USDC provides the infrastructure, the scale
and the team to deliver.